1. Advanced Manufacturing with Cloud, Internet of Things, and Sustainability (Hwaiyu Geng, P.E., Amica Research, USA)
2. Global Manufacturing (Yoram Koren, PhD,  University of Michigan)

3. Design for Manufacturing and Assembly (TR Kannan, PhD, Geometric Limited, India)

4. Design of Experiments (Larry Aft, P.E., Jay Boyle, Aft Systems, Inc.)

5. Design for Six Sigma (Mark Kiemele, PhD, Air Academy Associates)

6. Value Engineering (Tomoaki Onizuka, Japan Management Association Consultants Inc., Japan)

7. Basic Tools for Tolerance Analysis of Mechanical Assemblies (Ken Chase, PhD, Brigham Young University)

8. Quality Function Development (Larry Aft, P.E., Aft Systems, Inc.)

9. Computer Aided Design and Manufacturing (Gershon Elber, PhD, Technion, Israel)

10. CNC Control (Jerry Scherer, P.E., Fanuc America Corporation)

11. Adaptive Control for Machining Operations (Jerry Scherer, P.E., Fanuc America Corporation)

12. Manufacturing Simulation (Charles Harrell, PhD, Brigham Young University)

13. Foundations of Microsystems Manufacturing (Michael Huff, PhD, MEMS & Nanotechnology Exchange Corporation)

14. Nanotechnology and Manufacturing (Michael Huff, PhD, MEMS & Nanotechnology Exchange Corporation)

15. Additive Manufacturing or 3D Scanning and Printing (Linda Williams, University of Arkansas)

16. Heat Treatment: Principles & Practices (Daniel Herring, The Herring Group)

17. Metalcasting Processes (Kevin Fleischmann, American Foundry Society)

18. Powder Metallurgy (Chaman Lall, PhD, Metal Powder Products Company)

19. Welding, Brazing, and Thermal Cutting (Duane Miller, PhD, P.E., The Lincoln Electric Company)

20. Pressworking (Dennis Chen, Cyrus Kuo, Shieh Yih Machinery Industry Company, Taiwan, ROC)

21. Laser Materials Processing (Wenwu Zhang, PhD, NIMTE, China; Y. Lawrence Yao, PhD, Columbia U.)

22. Abrasive Jet Machining (John Olsen, PhD, OMAX Corporation)

23. Metalcutting, Turning and Milling (Hwaiyu Geng, P.E., Amica Research)

24. Holemaking (Christer Richt, Sandvik Coromant, Sandviken, Sweden)

25. Threading (Christer Richt, Sandvik Coromant, , Sandviken, Sweden)

26. Rolling Process (Howard Greis-deceased, Noel Greis, Charles Garniewicz, David Willens, Kinefac Corporation)

27. Tapping (Mark Johnson, Tapmatic Corporation)

28. Fundamentals of Gear & Gear Cutting (Michel Pasquier, CMD Gears Company, Cambrai, France )

29. Grinding (Mark Jackson, PhD, M.D. Whitfield, Bonded Abrasives Group, J. S. Morrell, Dept. of Energy, R. Handy, PhD, University of Northern Carolina

30. Electrical Discharge Machining, Electro Chemical Machining (Gisbert Ledvon, GF Machining Solutions)

31. Robotics and Automation (David Bruce, Claude Dinsmoor, Wesley Garrett, Nishant Jhaveri, Michael Sharpe, Fanuc America Corporation)

32. Machine Vision (Perry West, Automated Vision Systems, Inc.)

33. Composites Manufacturing Processes (Sebastian Goris, John Puentes, Tim Osswald, PhD, University of Wisconsin-Madison)

34. Plastic Molding Processes (Scott L. Peters, Molded Marketing LLC)

35. Injection Molds for Thermoplastics (Fred Steil, FGSteil Consulting)

36. Lean Manufacturing (Takao Izumi, Japan Management Association Consultants Inc., Japan)

37. Six-Sigma & Lean Manufacturing (Sophronia Ward, Shiela Polling, Mark Nash, Pinnacle Partners, Inc.)

38. Flexible Manufacturing Systems (John Lenz, PhD, CMS Research, Inc.)

39. Assembly Systems (Jack Hu, University of Michigan, PhD, Jeonghan Ko, PhD, Ajou University, Korea)

40. Work Cell Design (H. Lee Hales, Richard Muther & Associates)

41. Quality: Inspection, Test, and SPC (Roderick Munro, PhD, RAM Q Universe, Inc.)

42. Engineering Economics (Gerald Fleischer, PhD, University of Southern California)

43. Industrial Ergonomics (Dave Curry, PhD, John Meyer, PhD, ITC Experts)

44. Work Measurement (Larry Aft, P.E., Aft Systems, Inc.)

45. Operations Research in Manufacturing (V. Jorge Leon, PhD, Texas A&M University)

46. Supply Chain Management: Principles and Structures (David Ross, PhD, APICS)

SEMICONDUCTOR MANUFACTURING HANDBOOK (Second Edition), McGraw-Hill Professional, 2017

PART 1: SEMICONDUCTOR MANUFACTURING FUNDAMENTALS

 

1.     Semiconductor manufacturing, the IoT, and Data Analytics (Hwaiyu Geng, P.E., Amica Research, USA)

2.     Nanotechnology and Nano-manufacturing: From Silicon to New Carbon-based Materials and Beyond (Michael Huff, Ph.D., MEMS & Nanotechnology Exchange Corporation)

3.     FinFET Fundamentals and Nanoscale silicide formation (Liping Ren, Ph.D. Global Nano-systems, Inc., Yi-Chia Chou, Ph.D., National Jiaotong University, Taiwan, King-Ning Tu, Ph.D., UCLA)

4.     Fundamentals of Microsystems Manufacturing: An Empowering Technology for the IoT (Michael Huff, Ph.D., MEMS & Nanotechnology Exchange Corporation)

5.     Physical Design for High-performance, low-power, and reliable 3D IC (Ankur Srivastava, Ph.D., Tiantao Lu, Ph.D., University of Maryland)

 

PART 2: FRONT END OF LINE PROCESSES

 

6.      Epitaxy and molecular beam epitaxy (Jamal Ramdani, Ph.D., Power Integration Inc.)

7.      Thermal Processing: Anneals, RTP and Oxidation (David O’Meara, Tokyo Electron U.S. Holding, Inc.)

8.      Microlithography (Chris Mack, Ph.D., University of Texas)

9.      Etching (Nandita DasGupta, Ph.D., India Institute of Technology, India)

10.   Ion Implantation (Bo Vanderberg, Ph.D., Michael Ameen, Ph.D., Axcelis)

11.   Introduction to Physical Vapor Deposition and Sputtering (Florian Solzbacher, Ph.D., University of Utah)

12.   Chemical Vapor Deposition (Bin Dong, Jeffry Kelber, Ph.D., M. Sky Driver, Ph. D., University of North Texas)

13.   Atomic Layer Deposition (Eric Eisenbraun, Ph.D., SUNY Polytechnic Institute)

14.   Electrochemical Deposition, (John Klocke, Applied Materials)

15.   Fundamental Aspects of Chemical Mechanical Planarization (Gautam Banerjee, Ph.D., Air Products)

16.   AFM Metrology (Ardavan Zandiatashbar, Ph. D., Park System Inc.)

PART 3: BACK END OF LINE PROCESSES

 

17.   Interconnects Reliability (Roey Shaviv, Ph.D., Applied Materials)

18.   Wafer Thinning and Singulation (Youngsuk Kim, Sumio Masuchi, Noriko Ito, Miyuki Hirose, DISCO, Japan)

19.   Packaging (Michael Töpper, Ph.D., izm Fraunhofer, Dietrich Tönnies, Ph.D., ROFIN-SINAR Laser GmbH, Germany)

20.   Bonding Fundamentals (Ivy Qin, Ph.D., Kulicke & Soffa)

21.   Automatic Test Equipment (A.T. Sivaram, Advantest)

 

PART 4: TECHNOLOGIES FOR FLEXIBLE PRINTED ELECTRONICS AND LARGE-AREA ELECTRONICS

 

22.   Printed Electronics: Principles, Materials, Processes and Applications (Chuck Zhang, Ph.D., Kan Wang, Yung-Hang Chang, Ben Wang, Georgia Tech)

23.   Flexible Hybrid Electronic (Rich Chaney, American Semiconductor Inc.)

24.   Flexible Electronics (Dan Xie, Ph.D., Yilin Sun, Tsinghua University, Beijing, China)

25.   3D interconnects in Flexible Electronics (Ahmed Busnaina, Ph.D., Cihan Yilmaz, Ph.D., Northeastern University)

26.   RF Printed Electronics: Communication, Sensing and Energy Harvesting (Bijian Tehrani, Emmanouil Tentzeris, Ph.D., Georgia Tech)

27.   Printing of Nanoscale Electronics and Power Electronics (Ahmed Busnaina, Ph.D., Cihan Yilmaz, Ph.D., Northeastern University)

28.   Materials for Inkjet Printed Touch Sensors (Nesrine Kammoun, Christian Renninger, Norbert Fruehauf, University of Stuttgart, Germany)

29.   Flat Panel and Flexible Display Technology (Cheng-chung Lee, Ph.D., Yung-Hui Yeh, Ph.D., Yuh-Zheng Lee, Ph.D., ITRI, David N. Liu, Ph.D., Idearite, Taiwan, ROC)

30.   Photovoltaics Fundamentals, Manufacturing, Installation and Operations (Jun Zhuge, ET Solar, Inc., China)

 

PART 5: PROCESS GASES & CHEMICALS

 

31.   Gas Distribution Systems (Ken Grosser, James McAndrew, Ph.D., Tracey Jacksier, Ph.D.,  Air Liquide)

32.   Fundamentals of Ultrapure Water (Vyacheslay (Slava) Libman, Ph.D., Air Liquide)

33.   Process chemicals, handling and Abatement (Dan Fuchs, Ph.D., Air Liquide)

34.   Filtration (Barry Gotlinsky, Ph.D., Nanometrex Solutions LLC)

35.   Chemical and Slurry Handling Systems (Kristin Cavicchi, Air Liquide)

PART 6: OPERATIONS, EQUIPMENT, AND FACILITIES

 

36.   Yield Management (Dieter Rathei, Ph.D., D R Yield, Austria)

37.   CIM and Factory Automation (Clint Harris, Entegris, Inc.)

38.   Manufacturing Execution System Fundamentals (Julie Fraser, Iyno Advisors)

39.   Advanced Process Control (Raymond Van Roijen, Global Foundries)

40.   Airborne Molecular Contamination (Chris Muller, Purafil)

41.   ESD Controls in Cleanroom Environments (Larry Levit, Ph.D., LBL Scientific)

42.   Vacuum systems (Mike Czerniak, Ph.D., Edwards, U.K.)

43.   Control of RF Plasma Processing (David Coumou, MKS Instruments)

44.   IC Manufacturing Equipment Parts Cleaning Technology (Ardeshir Sidhwa, Ph.D., Dave Zuck, Quantum Global Technologies, LLC)

45.   Equipment Design Challenges Due To Changing Regulations (Mark Fessler, Tokyo Electron Limited)

46.   Cleanroom Design and Construction (Richard Pavlotsky, Ph.D., Cleanroom, cGMP Technologist)

47.   Vibration and Noise Design (Michael Gendreau, Hal Amick, Ph.D., Colin Gordon Associates)

DATA CENTER HANDBOOK (John Wiley & Sons, 2015)

33.   Data Center Infrastructure Management: Mark Harris, Nlyte Software

34.   Computerized Maintenance Management System: Peter Sacco, President, PTS Datacenter System

35.   DC Disaster Prevention and Business Continuity: Chris Gabriel, Logicalis, United Kingdom

36.   Lessons Learned from Natural Disasters and Preparedness: Hwaiyu Geng, Masatoshi Kajimoto, Japan

China National Standards (GB 50174 – 2017)

 COVER

数据中心设计规范

Code for Design of Data Centers

(This is a work-in-process English version of the Code.  If any question arises in the interpretation of this Code, the Chinese version of the Code takes precedence.)

Released date: May 4, 2017  

Effective Date: January 1, 2018

Jointly issued by:

The Ministry of Housing and Urban-Rural Development of the People’s Republic of China,

The General Administration of Quality Supervision, Inspection and Quarantine of the People’s Republic of China.

Editor-in-Chief:

The Ministry of Industry and Information Technology of the People’s Republic of China

Approved by:

The Ministry of Housing and Urban-Rural Development of the People’s Republic of China

Effective Date: January 1, 2018

中国计划出版社

China Planning Press

(http://www.jhpress.com/#1)

2017 Beijing

 FRONT MATTER

Announcement by the Ministry of Housing and Urban-Rural Development

People’s Republic of China

No. 1541

Announcement and release of national standards the《Code for Design of Data Centers》by the Ministry of Housing and Urban-Rural Development of the People’s Republic of China

Effective January 1, 2018, the 《Code for Design of Data Centers》, number GB50174-2017, is hereby approved as the national standard.

Among them, Articles 8.4.4、13.2.1、13.2.4、13.3.1、13.4.1 are mandatory provisions and must be strictly enforced. The original 《Code for Design of Electronics Information System Room》 number GB50174-2008, shall be abolished at the same time.

This code is organized by the Ministry’s Standard Quota Research Institute and published by the China Planning Press.

The Ministry of Housing and Urban-Rural Development of the People’s Republic of China

May 4, 2017

Foreword

According to the notice and requirements from the Ministry of Housing and Urban-Rural Development regarding 《The Formulation and Revision Plan of the 2011 Engineering Construction Standard》, or Jianbiao [2011] No. 17, the China Electronics Engineering Design Institute and relevant organizations have revised the original national standard titled 《Code for Design of Electronics Information System Room》 number GB50174-2008 to this code (hereinafter referred to as The Code).

     During the revision process, the Code working group conducted extensive investigations, summarized practical experience, referred to relevant international advanced standards, and extensive solicitation of comments, to revised and perfected in finalizing the Code.

     This Code is divided into 13 chapters and an appendix section with the following main technical contents: general provisions, terminology, rating classification and performance requirements, site selection and equipment layout, environmental requirements, building and structure, air conditioning, electrical system, electromagnetic shielding, network and cabling system, intelligent system, water supply and drainage, fire protection and safety.

The main revisions of this code include:

1. To satisfy broad design requirements by different industries, the definition of Class A data center is added to meet design requirements based on sizes and purposes of data centers.

2. Added data center design requirements to cover network system and disaster preparedness.

3. Changed the name of chapter 11 “Security and Protection Control“ to “ Intelligent System”.

     The boldfaced type are mandatory provisions and they must be strictly enforced. 

The chief editor, the participating organizations, the main drafters and reviewers of this code are as follows:

 Editor-in-Chief: China Electronics Engineering Design Institute

 The participating organization:

世源科技工程有限公司

S.Y. Technology, Engineering & Construction Co., Ltd.

WWW.sytec.com

http://www.ceedi.com.cn/templates/second/index.aspx?nodeid=9&page=ContentPage&contentid=690

(Within CEEDI and SDIC)

中国航空规划设计研究总院有限公司

China Aviation Planning and Design Institute (Group) Co., Ltd.

http://www.avic-capdi.com/

上海建筑设计研究院有限公司

Institute of Shanghai Architectural Design & Research Co., Ltd.

https://www.aisa.com.cn/about.html

http://www.arcplus.com.cn/en/profile.html

中国建筑设计研究院

CHINA ARCHITECTURE DESIGN & RESEARCH GROUP

http://en.cadreg.com/

总装备部工程设计研究总院

URL not Available

中国机房设施工程有限公司

China Computer Room Equipment Engineering Co., Ltd.

http://www.zhonghuan.com/system/2019/11/18/030000972.shtml

太极计算机股份有限公司

Taiji Computer Corporation Limited

https://www.taiji.com.cn/TaijiCMS/html/gywm.html

北京捷通机房设备工程有限公司 (捷通智慧科技股份有限公司)

Beijing Chatone Computer Room Equipment and Engineering Co., Ltd.

http://www.chatone.com.cn/Solutions/DataCenter/

信息产业电子第十一设计研究院科技工程股份有限公司

The IT Electronics Eleventh Design & Research Institute Scientific and Technological Engineering Corporation Limited

http://www.edri.net.cn/

北京科计通电子工程有限公司

Beijing Kejitong electronic engineering Co., Ltd.

http://www.kj.com.cn/

艾默生网络能源有限公司

Emerson network power Co., Ltd.

www.emersonnwp.cn

西门子（中国）有限公司

Siemens Ltd., China

https://new.siemens.com/cn/zh.html

上海国际商业机器工程技术有限公司

IBM Engineering Technology (Shanghai) Co., Ltd.

https://www.ibm.com/planetwide/cn/

美国西蒙公司

The Siemon Company

http://www.siemon.com.cn/

浙江一舟电子科技股份有限公司

Zhejiang Ship Electronics Technology Co., Ltd. (Ship Group)

http://www.shipgroup.net/

湖北安华智能股份公司

Anhua Intelligent Technology Co., Ltd.

http://www.chn-anhua.com/index.php

Main Drafters: 

钟景华 (Zhong Jinghua), 晁阳 (Chao Yang), 丁杰 (Ding Jie), 陈众励 (Chen Zhongli), 丁麒钢 (Ding Qigang), 陈宇通,  (Chen Yutong), 曹播 (Cao Bo), 刘志 (Liu Zhi), 王鹏 (Wang Peng), 晁怀颇 (Chao Huaipo), 黄群骥 (Huang Qunji), 邓馨, (Deng Xin), 单晨 (Shan Chen), 陈亮 (Chen Liang), 黄锴 (Huang Kai), 肖必龙 (Xiao Bilong),  宋孝春 (Song Xiaochun), 马名东 (Ma Mingdong), 崔炎 (Cui Yan), 张旭 (Zhang Xu), 刘喜明 (Liu Ximaing), 杨剑波 (Yang Jianbo), 夏双兵 (Xia Shuangbing), 武顺伟 (Wu Shunwei), 黎江 (Li Jiang), 杜宝强 (Du Baoqiang), 王振军 (Wang Zhenjun), 汪怡平 (Wang Yiping), 许晓峰 (Xu Xiaofeng), 张迎军 (Zhang Yingjun)

 Chief Reviewers:

孙兰 (Sun Lan), 王海峰 (Wang Haifeng), 邓重秋 (Deng Zhongqiu), 朱立彤(Zhu Litong), 寇九贵 (Kou Jiugui), 刘凯 (Liu Kai),   路世昌 (Lu Shichang), 屈焰 (Qu Yan), 方良周 (Fang Liangzhou),  Qu Haifeng (曲海峰), 杨晓平 (Yang Xiaoping), 万英北 (Wan Yingbei),  张敬 (Zhang Jing), 陈川 (Chen Chuan), 安真 (An Zhen)

Code for Design of Data Centers, GB 50174 - 2017

Table of Contents  

1   General provisions                                                                                         

2   Terms and symbols                                                                                        

2.1  Terms                                                                                                   

2.2  Symbols                                                                                               

3   Rating classification and required features                                                  

3.1  Rating classification                                                                             

3.2  Required features                                                                                

4   Site selection and equipment layout                                                            

4.1  Site selection                                                                                        

4.2  Composition                                                                                         

4.3  Equipment layout                                                                                 

5  Environmental requirement                                                                           

5.1  Temperature，dew point temperature and airborne particle concentration

5.2  Noise，electromagnetic interference，vibration and  static electricity 

6  Building and structure                                                                                    

6.1  General requirement                                                                           

6.2  People flow and goods flow, entrances and exits                              

6.3 Retaining structure thermal design and energy saving measure       

6.4  Interior design                                                                                      

7   Air conditioning                                                                                             

7.1  General requirement                                                                           

7.2  Thermal load calculation                                                                     

7.3  Airflow  management                                                                          

7.4  System design                                                                                       

7.5  Equipment selection                                                                            

8  Electrical Systems                                                                                            

8.1  Power Supply and distribution                                                           

8.2  Lighting                                                                                                 

8.3  Electrostatic discharge protection                                                       

8.4  Lightning protection and grounding                                                   

9  Electromagnetic Shielding                                                                              

9.1  General requirement                                                                           

9.2  Shielding structure                                                                               

9.3  Shielding objects                                                                                  

10  Network and cabling system                                                                        

10.1  Network system                                                                                  

10.2  Cabling system                                                                                   

11  Intelligent system                                                                                          

11.1  General requirement                                                                         

11.2  Environment and equipment monitoring                                         

11.3  Security system                                                                                   

11.4  Enterprise command center                                                              

12  Water supply and drainage                                                                          

12.1  General requirement                                                                         

12.2  Piping layout                                                                                                                    

13  Fire protection and safety                                                                            

13.1  General requirement                                                                         

13.2  Fire prevention and evacuation                                                        

13.3  Fire protection facilities

13.4  Safety measure                                                                                                                                                                                                                                   

1.0  General provision

1.0.1       This code is prepared to standardize the design of data center that ensures safe, stable and reliable operations of electronic information system, as well as to encompass advanced technology, economy, safety, energy conservation and sustainability.

1.0.2       This code is applicable to the design of new construction, retrofit, or expansion of data centers.

1.0.3       The design of data center shall follow short-term business plan with balance of the long-term development plan.

1.0.4       The design of data center shall not only conform to this code, but also to other relevant China National Standards.

2             Terms and symbols

2.1  Terms

2.1.1       Data center

(To be continued)

Appendix A: Technical requirements for data center rating                              

Description of wording in this code                                                                   

List of quoted standards                                                                                      

Explanation of provisions