MANUFACTURING ENGINEERING HANDBOOK (Second Edition), McGraw-Hill Professional, 2016 Chapters
SEMICONDUCTOR MANUFACTURING HANDBOOK (Second Edition), McGraw-Hill Professional, 2017 PART 1: SEMICONDUCTOR MANUFACTURING FUNDAMENTALS
1. Semiconductor manufacturing, the IoT, and Data Analytics (Hwaiyu Geng, P.E., Amica Research, USA) 2. Nanotechnology and Nano-manufacturing: From Silicon to New Carbon-based Materials and Beyond (Michael Huff, Ph.D., MEMS & Nanotechnology Exchange Corporation) 3. FinFET Fundamentals and Nanoscale silicide formation (Liping Ren, Ph.D. Global Nano-systems, Inc., Yi-Chia Chou, Ph.D., National Jiaotong University, Taiwan, King-Ning Tu, Ph.D., UCLA) 4. Fundamentals of Microsystems Manufacturing: An Empowering Technology for the IoT (Michael Huff, Ph.D., MEMS & Nanotechnology Exchange Corporation) 5. Physical Design for High-performance, low-power, and reliable 3D IC (Ankur Srivastava, Ph.D., Tiantao Lu, Ph.D., University of Maryland)
PART 2: FRONT END OF LINE PROCESSES
6. Epitaxy and molecular beam epitaxy (Jamal Ramdani, Ph.D., Power Integration Inc.) 7. Thermal Processing: Anneals, RTP and Oxidation (David O’Meara, Tokyo Electron U.S. Holding, Inc.) 8. Microlithography (Chris Mack, Ph.D., University of Texas) 9. Etching (Nandita DasGupta, Ph.D., India Institute of Technology, India) 10. Ion Implantation (Bo Vanderberg, Ph.D., Michael Ameen, Ph.D., Axcelis) 11. Introduction to Physical Vapor Deposition and Sputtering (Florian Solzbacher, Ph.D., University of Utah) 12. Chemical Vapor Deposition (Bin Dong, Jeffry Kelber, Ph.D., M. Sky Driver, Ph. D., University of North Texas) 13. Atomic Layer Deposition (Eric Eisenbraun, Ph.D., SUNY Polytechnic Institute) 14. Electrochemical Deposition, (John Klocke, Applied Materials) 15. Fundamental Aspects of Chemical Mechanical Planarization (Gautam Banerjee, Ph.D., Air Products) 16. AFM Metrology (Ardavan Zandiatashbar, Ph. D., Park System Inc.)
PART 3: BACK END OF LINE PROCESSES
17. Interconnects Reliability (Roey Shaviv, Ph.D., Applied Materials) 18. Wafer Thinning and Singulation (Youngsuk Kim, Sumio Masuchi, Noriko Ito, Miyuki Hirose, DISCO, Japan) 19. Packaging (Michael Töpper, Ph.D., izm Fraunhofer, Dietrich Tönnies, Ph.D., ROFIN-SINAR Laser GmbH, Germany) 20. Bonding Fundamentals (Ivy Qin, Ph.D., Kulicke & Soffa) 21. Automatic Test Equipment (A.T. Sivaram, Advantest)
PART 4: TECHNOLOGIES FOR FLEXIBLE PRINTED ELECTRONICS AND LARGE-AREA ELECTRONICS
22. Printed Electronics: Principles, Materials, Processes and Applications (Chuck Zhang, Ph.D., Kan Wang, Yung-Hang Chang, Ben Wang, Georgia Tech) 23. Flexible Hybrid Electronic (Rich Chaney, American Semiconductor Inc.) 24. Flexible Electronics (Dan Xie, Ph.D., Yilin Sun, Tsinghua University, Beijing, China) 25. 3D interconnects in Flexible Electronics (Ahmed Busnaina, Ph.D., Cihan Yilmaz, Ph.D., Northeastern University) 26. RF Printed Electronics: Communication, Sensing and Energy Harvesting (Bijian Tehrani, Emmanouil Tentzeris, Ph.D., Georgia Tech) 27. Printing of Nanoscale Electronics and Power Electronics (Ahmed Busnaina, Ph.D., Cihan Yilmaz, Ph.D., Northeastern University) 28. Materials for Inkjet Printed Touch Sensors (Nesrine Kammoun, Christian Renninger, Norbert Fruehauf, University of Stuttgart, Germany) 29. Flat Panel and Flexible Display Technology (Cheng-chung Lee, Ph.D., Yung-Hui Yeh, Ph.D., Yuh-Zheng Lee, Ph.D., ITRI, David N. Liu, Ph.D., Idearite, Taiwan, ROC) 30. Photovoltaics Fundamentals, Manufacturing, Installation and Operations (Jun Zhuge, ET Solar, Inc., China)
PART 5: PROCESS GASES & CHEMICALS
31. Gas Distribution Systems (Ken Grosser, James McAndrew, Ph.D., Tracey Jacksier, Ph.D., Air Liquide) 32. Fundamentals of Ultrapure Water (Vyacheslay (Slava) Libman, Ph.D., Air Liquide) 33. Process chemicals, handling and Abatement (Dan Fuchs, Ph.D., Air Liquide) 34. Filtration (Barry Gotlinsky, Ph.D., Nanometrex Solutions LLC) 35. Chemical and Slurry Handling Systems (Kristin Cavicchi, Air Liquide)
PART 6: OPERATIONS, EQUIPMENT, AND FACILITIES
36. Yield Management (Dieter Rathei, Ph.D., D R Yield, Austria) 37. CIM and Factory Automation (Clint Harris, Entegris, Inc.) 38. Manufacturing Execution System Fundamentals (Julie Fraser, Iyno Advisors) 39. Advanced Process Control (Raymond Van Roijen, Global Foundries) 40. Airborne Molecular Contamination (Chris Muller, Purafil) 41. ESD Controls in Cleanroom Environments (Larry Levit, Ph.D., LBL Scientific) 42. Vacuum systems (Mike Czerniak, Ph.D., Edwards, U.K.) 43. Control of RF Plasma Processing (David Coumou, MKS Instruments) 44. IC Manufacturing Equipment Parts Cleaning Technology (Ardeshir Sidhwa, Ph.D., Dave Zuck, Quantum Global Technologies, LLC) 45. Equipment Design Challenges Due To Changing Regulations (Mark Fessler, Tokyo Electron Limited) 46. Cleanroom Design and Construction (Richard Pavlotsky, Ph.D., Cleanroom, cGMP Technologist) 47. Vibration and Noise Design (Michael Gendreau, Hal Amick, Ph.D., Colin Gordon Associates) DATA CENTER HANDBOOK (John Wiley & Sons, 2015) Chapters
1. Data Centers and Strategic Planning: Hwaiyu Geng, P.E., Amica Research, USA 2. Energy and Sustainability in Data Centers: Bill Kosik, P.E., Hewlett-Packard Company 3. Hosting and Colocation: Chris Crosby, Chris Curtis, Compass Datacenters 4. Modular Data Centers: Wade Vinson, Hewlett-Packard Company 5. Site Selection: Ken Baudry, P.E., K.J. Baudry, Inc. 6. Financial Analysis: Liam Newcombe, Romonet, United Kingdom 7. China Data Center Overview: Zhe Liu, China Electronics Standardization Institute, China 8. Korea Data Center Overview: Minseok Kwon, Mingoo Kim, Hanwook Bae, Samsung SDS, Korea 9. Architecture Design: Rack and Layout Design: Phil Isaak, P.E., DCDC, RCDD, Isaak Technologies, Inc. 10. Mechanical Design: John Weale, P.E., the Integral Group 11. Electrical Design: Jay Park, P.E., Sarah Hanna, Facebook 12. Fire Protection Design: Sean Donohue, P.E., Hughes Associates, Inc. 13. Structure Design: David Bonneville, S.E., Robert Pekelnicky, S.E., Degenkolb Engineers 14. TIA 942-A Overview: Alexander Jew, J&M Consultants 15. Reliability and Redundancy: Malik Megdiche, Ph.D., Schneider Electric, France 16. Particulate and Gaseous contamination in Data Centers, Taewon Han, Ph.D., State U. of New Jersey 17. Computational Fluid Dynamics: Mark Seymour, Founder, Future Facilities, United Kingdom 18. Environment Management: Veerendra Mulay, Ph.D., Facebook 19. Project Management and Commissioning: Lynn Brown, PsyD, P.E., Facilities Management Solutions 20. Cloud, VM, SDN Fundamentals: Cherkaoui Omar, Ph.D., University of Quebec, Canada 21. Green Microprocessor & Server Design: Guy AILee, P.E., Intel 22. Energy Star and Server Design: Joe Prisco, Jay Dietrich, System and Technical Engineer, IBM 23. Raised Floors vs. Overhead Cooling: Vali Sorell, P.E., VP, Syska Hennessy 24. Hot and Cold Aisle Containments: David Moody, Schneider Electric 25. Free Cooling Technologies: Nick Des Champs, Ph.D., P.E.; Keith Dunnavant, P.E., Munters 26. Rack-Level ITC Equipment Cooling: Henry Coles, Steve Greenberg, LBNL; Phil Hughes, Clustered Systems 27. UPS: Chris Loeffler, Ed Spears, UPS Product Managers, Eaton Corporation 28. Direct Current Networks: Sofia Bergquist, IBM, Sweden 29. Rack PDU: Ching-I Hsu, Ph.D., Raritan Americas, Inc. 30. Renewable Energy and Data Centers: William Kao, Ph.D., CARES 31. Smart Grid and Demand Response: Girish Ghatikar, P.E., Lawrence Berkeley National Laboratory 32.
Benchmarking
Metrics: Bill Kosik, P.E., Hewlett-Packard Company 33. Data Center Infrastructure Management: Mark Harris, Nlyte Software 34. Computerized Maintenance Management System: Peter Sacco, President, PTS Datacenter System 35. DC Disaster Prevention and Business Continuity: Chris Gabriel, Logicalis, United Kingdom 36. Lessons Learned from Natural Disasters and Preparedness: Hwaiyu Geng, Masatoshi Kajimoto, Japan China National Standards (GB 50174 – 2017) COVER 数据中心设计规范 Code for Design of Data Centers (This is a work-in-process English version of the Code. If questions arise in the interpretation of this Code, the Chinese version of the Code takes precedence.)
Released date: May 4, 2017 Effective Date: January 1, 2018 Jointly issued by: The Ministry of Housing and Urban-Rural Development of the People’s Republic of China, The General Administration of Quality Supervision, Inspection and Quarantine of the People’s Republic of China. Editor-in-Chief: The Ministry of Industry and Information Technology of the People’s Republic of China Approved by: The Ministry of Housing and Urban-Rural Development of the People’s Republic of China
Effective Date: January 1, 2018
中国计划出版社 China Planning Press 2017 Beijing FRONT MATTER
Announcement by the Ministry of Housing and Urban-Rural Development People’s Republic of China
No. 1541
Announcement and release of national standards the《Code for Design of Data Centers》by the Ministry of Housing and Urban-Rural Development of the People’s Republic of China Effective January 1, 2018, the 《Code for Design of Data Centers》, number GB50174-2017, is hereby approved as the national standard.
Among them, Articles 8.4.4、13.2.1、13.2.4、13.3.1、13.4.1 are mandatory provisions and must be strictly enforced. The original 《Code for Design of Electronics Information System Room》 number GB50174-2008, shall be abolished at the same time. This code is organized by the Ministry’s Standard Quota Research Institute and published by the China Planning Press. The Ministry of Housing and Urban-Rural Development of the People’s Republic of China May 4, 2017
Foreword According to the notice and requirements from the Ministry of Housing and Urban-Rural Development regarding 《The Formulation and Revision Plan of the 2011 Engineering Construction Standard》, or Jianbiao [2011] No. 17, the China Electronics Engineering Design Institute and relevant organizations have revised the original national standard titled 《Code for Design of Electronics Information System Room》 number GB50174-2008 to this code (hereinafter referred to as The Code). During the revision process, the Code working group conducted extensive investigations, summarized practical experience, referred to relevant international advanced standards, and extensive solicitation of comments, to revised and perfected in finalizing the Code. This Code is divided into 13 chapters and an appendix section with the following main technical contents: general provisions, terminology, rating classification and performance requirements, site selection and equipment layout, environmental requirements, building and structure, air conditioning, electrical system, electromagnetic shielding, network and cabling system, intelligent system, water supply and drainage, fire protection and safety.
The main revisions of this code include: 1. To satisfy broad design requirements by different industries, the definition of Class A data center is added to meet design requirements based on sizes and purposes of data centers. 2. Added data center design requirements to cover network system and disaster preparedness. 3. Changed the name of chapter 11 “Security and Protection Control“ to “ Intelligent System”. The boldfaced type are mandatory provisions and they must be strictly enforced.
The chief editor, the participating organizations, the main drafters and reviewers of this code are as follows: Editor-in-Chief: China Electronics Engineering Design Institute The participating organization: 世源科技工程有限公司 S.Y. Technology, Engineering & Construction Co., Ltd. WWW.sytec.com http://www.ceedi.com.cn/templates/second/index.aspx?nodeid=9&page=ContentPage&contentid=690 (Within CEEDI and SDIC) 中国航空规划设计研究总院有限公司 China Aviation Planning and Design Institute (Group) Co., Ltd. 上海建筑设计研究院有限公司 Institute of Shanghai Architectural Design & Research Co., Ltd. https://www.aisa.com.cn/about.html http://www.arcplus.com.cn/en/profile.html 中国建筑设计研究院 CHINA ARCHITECTURE DESIGN & RESEARCH GROUP 总装备部工程设计研究总院 URL not Available 中国机房设施工程有限公司 China Computer Room Equipment Engineering Co., Ltd. http://www.zhonghuan.com/system/2019/11/18/030000972.shtml 太极计算机股份有限公司 Taiji Computer Corporation Limited https://www.taiji.com.cn/TaijiCMS/html/gywm.html 北京捷通机房设备工程有限公司 (捷通智慧科技股份有限公司) Beijing Chatone Computer Room Equipment and Engineering Co., Ltd. http://www.chatone.com.cn/Solutions/DataCenter/ 信息产业电子第十一设计研究院科技工程股份有限公司 The IT Electronics Eleventh Design & Research Institute Scientific and Technological Engineering Corporation Limited 北京科计通电子工程有限公司 Beijing Kejitong electronic engineering Co., Ltd. 艾默生网络能源有限公司 Emerson network power Co., Ltd. www.emersonnwp.cn 西门子(中国)有限公司 Siemens Ltd., China https://new.siemens.com/cn/zh.html 上海国际商业机器工程技术有限公司 IBM Engineering Technology (Shanghai) Co., Ltd. https://www.ibm.com/planetwide/cn/ 美国西蒙公司 The Siemon Company 浙江一舟电子科技股份有限公司 Zhejiang Ship Electronics Technology Co., Ltd. (Ship Group) 湖北安华智能股份公司 Anhua Intelligent Technology Co., Ltd. http://www.chn-anhua.com/index.php
Main Drafters: 钟景华 (Zhong Jinghua), 晁阳 (Chao Yang), 丁杰 (Ding Jie), 陈众励 (Chen Zhongli), 丁麒钢 (Ding Qigang), 陈宇通, (Chen Yutong), 曹播 (Cao Bo), 刘志 (Liu Zhi), 王鹏 (Wang Peng), 晁怀颇 (Chao Huaipo), 黄群骥 (Huang Qunji), 邓馨, (Deng Xin), 单晨 (Shan Chen), 陈亮 (Chen Liang), 黄锴 (Huang Kai), 肖必龙 (Xiao Bilong), 宋孝春 (Song Xiaochun), 马名东 (Ma Mingdong), 崔炎 (Cui Yan), 张旭 (Zhang Xu), 刘喜明 (Liu Ximaing), 杨剑波 (Yang Jianbo), 夏双兵 (Xia Shuangbing), 武顺伟 (Wu Shunwei), 黎江 (Li Jiang), 杜宝强 (Du Baoqiang), 王振军 (Wang Zhenjun), 汪怡平 (Wang Yiping), 许晓峰 (Xu Xiaofeng), 张迎军 (Zhang Yingjun) Chief Reviewers: 孙兰 (Sun Lan), 王海峰 (Wang Haifeng), 邓重秋 (Deng Zhongqiu), 朱立彤(Zhu Litong), 寇九贵 (Kou Jiugui), 刘凯 (Liu Kai), 路世昌 (Lu Shichang), 屈焰 (Qu Yan), 方良周 (Fang Liangzhou), Qu Haifeng (曲海峰), 杨晓平 (Yang Xiaoping), 万英北 (Wan Yingbei), 张敬 (Zhang Jing), 陈川 (Chen Chuan), 安真 (An Zhen)
Code for Design of Data Centers, GB 50174 - 2017 Table of Contents 1 General provisions 2 Terms and symbols 2.1 Terms 2.2 Symbols 3 Rating classification and required features 3.1 Rating classification 3.2 Required features 4 Site selection and equipment layout 4.1 Site selection 4.2 Composition 4.3 Equipment layout 5 Environmental requirement 5.1 Temperature,dew point temperature and airborne particle concentration 5.2 Noise,electromagnetic interference,vibration and static electricity 6 Building and structure 6.1 General requirement 6.2 People flow and goods flow, entrances and exits 6.3 Retaining structure thermal design and energy saving measure 6.4 Interior design 7 Air conditioning 7.1 General requirement 7.2 Thermal load calculation 7.3 Airflow management 7.4 System design 7.5 Equipment selection 8 Electrical Systems 8.1 Power Supply and distribution 8.2 Lighting 8.3 Electrostatic discharge protection 8.4 Lightning protection and grounding 9 Electromagnetic Shielding 9.1 General requirement 9.2 Shielding structure 9.3 Shielding objects 10 Network and cabling system 10.1 Network system 10.2 Cabling system 11 Intelligent system 11.1 General requirement 11.2 Environment and equipment monitoring 11.3 Security system 11.4 Enterprise command center 12 Water supply and drainage 12.1 General requirement 12.2 Piping layout 13 Fire protection and safety 13.1 General requirement 13.2 Fire prevention and evacuation 13.3 Fire protection facilities 13.4 Safety measure 1.0 General provision 1.0.1 This code is prepared to standardize the design of data center that ensures safe, stable and reliable operations of electronic information system, as well as to encompass advanced technology, economy, safety, energy conservation and sustainability. 1.0.2 This code is applicable to the design of new construction, retrofit, or expansion of data centers. 1.0.3 The design of data center shall follow short-term business plan with balance of the long-term development plan. 1.0.4 The design of data center shall not only conform to this code, but also to other relevant China National Standards.
2 Terms and symbols 2.1 Terms 2.1.1 Data center
(To be continued) Appendix A: Technical requirements for data center rating Description of wording in this code List of quoted standards Explanation of provisions IoT/ DATA ANALYTICS HANDBOOK (John Wiley & Sons, 2017) PART I INTERNET OF THINGS Chapter 1: Internet of Things and Data Analytics in the Cloud with Innovation and Sustainability, Hwaiyu Geng (USA) Chapter 2: Digital Services and Sustainable Solutions, Rikke Gram-Hansen (Denmark) Chapter 3: The Industrial Internet of Things (IIoT): Applications and Taxonomy, Stan Schneider Chapter 4: Strategic Planning for Smarter Cities, Jonathan Reichental Chapter 5: Next Generation Learning – Smart Medical Team Training, Brenda Bannan, Shane Gallagher, and Bridget Lewis Chapter 6: The Brain-Computer Interface in the Internet of Things, Jim McKeeth Chapter 7: IOT Innovation Pulse, John Mattison PART II INTERNET OF THINGS TECHNOLOGIES
Chapter 8: The Internet of Things Opens Source Systems, Scott Amyx Chapter 9: MEMS: An Enabling Technology for the Internet of Things (IoT), Michael A. Huff Chapter 10: Electro-Optic Infrared Sensor Technologies for the Internet of Things,Venkataraman Sundareswaran, Henry Yuan, Kai Song, Joseph Kimchi, and JihFen Lei Chapter 11: IPv6 for IoT and Gateway, Geoff Mulligan Chapter 12: Wireless Sensor Networks, David Y. Fong Chapter 13: Networking Protocols and Standards for Internet of Things, Tara Salman and Raj Jain Chapter 14: IoT Architecture, Shyam Varan Nath Chapter 15: A Designer’s Guide to the Internet of Wearable Things, David Hindman and Peter Burnham Chapter 16: Beacon Technology with IoT and Big Data, Nick Stein and Stephanie Urbanski (Austria) Chapter 17: SCADA Fundamentals and Applications in the IoT, Rich Hunzinger
PART III DATA ANALYTICS TECHNOLOGIES
Chapter 18: Data Analysis and Machine Learning Effort In Healthcare: Organization, Limitations, Development Of An Approach, Oleg Roderick, David Sanchez, David Sanchez, and Arun Aryasomajula Chapter 19: Data Analytics and Predictive Analytics in the Era of Big Data, Amy Shi-Nash and David R. Hardoon (Singapore) Chapter 20: Strategy Development and Big Data Analytics, Neil Fraser (Australia) Chapter 21: Risk Modeling and Data Science, Joshua Frank Chapter 22: Hadoop Technology, Scott Shaw Chapter 23: Security of IoT data: Context, Depth, and Breadth across Hadoop, Pratik Verma
PART IV SMART EVERYTHING
Chapter 24: Connected Vehicle, Adrian Pearmine Chapter 25: In-Vehicle Health and Wellness: An Insider Story, Pramita Mitra, Craig Simonds, Yifan Chen, and Gary Strumolo Chapter 26: GE’s Industrial Internet, David Bartlett Chapter 27: Smart City Architecture and Planning: Evolving Systems through IoT, Dominique Davison and Ashley Z. Hand Chapter 28: Non-Revenue Water, Kenneth Thompson, Brian Skeens, and Jennifer Liggett Chapter 29: IoT and Smart Infrastructure, George Lu and YJ Yang Chapter 30: Internet of Things and Smart Grid Standards, Girish Ghatikar Chapter 31: IoT Revolution in Oil and Gas Industry, Satyam Priyadarshy Chapter 32: Modernizing the Mining Industry with the Internet of Things, Rafael Laskier (Brazil) Chapter 33: Internet of Things Based Cyber Physical Frameworks for Advanced Manufacturing and Medicine, J. Cecil
PART V IOT/DATA ANALYTICS CASE STUDIES
Chapter 34: Defragmenting Intelligent Transportation: A Practical Case Study, Alan Carlton, Rafael Cepeda, and Tim Gammons (UK) Chapter 35: Connected and Autonomous Vehicles, Levent Guvenc, Bilin Aksun Guvenc, and Mumin Tolga Emirler Chapter 36: Transit Hub: A Smart Decision Support System for Public Transit Operations, Shashank Shekhar, Fangzhou Sun, Abhishek Dubey, Aniruddha Gokhale, Himanshu Neema, Martin Lehofer and Dan Freudberg Chapter 37: Smart Home Services Using the Internet of Things, Gene Wang and Danielle Song Chapter 38: Emotional Insights via Wearables, Gawain Morrison (UK) Chapter 39: A single platform approach for the management of emergency in complex environments such as large events, digital cities and networked regions, Francesco Valdevies (Italy) Chapter 40: Structural Health Monitoring, George Lu and YJ Yang Chapter 41: Home Healthcare and Remote Patient Monitoring, Karthi Jeyabalan
PART VI CLOUD, LEGAL, INNOVATION, AND BUSINESS MODELS
Chapter 42: Internet of Things and Cloud Computing, James Osborne Chapter 43: Internet of Things: Privacy and Security Legal Issues, Francoise Gilbert Chapter 44: IoT and Innovation, William Kao Chapter 45: IoT Business Models, Hubert C.Y. Chan (Hong Kong, China) ©2020 AmicaResearch.org |